Arbitrary Modeling of TSVs for 3D Integrated Circuits 1

Data & IT

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Khaled Salah • Yehea Ismail • Alaa El-Rouby

Pocket

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179 sidor
2016

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Författare: Khaled Salah, Yehea Ismail, Alaa El-Rouby
Format: Pocket/Paperback
ISBN: 9783319374970
Språk: Engelska
Antal sidor: 179
Utgivningsdatum: 2016-08-23
Förlag: Springer International Publishing AG