2299:-
Uppskattad leveranstid 7-12 arbetsdagar
Fri frakt för medlemmar vid köp för minst 249:-
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
- Format: Pocket/Paperback
- ISBN: 9780071737739
- Språk: Engelska
- Antal sidor: 220
- Utgivningsdatum: 2003-10-01
- Förlag: McGraw-Hill Inc.,US