Data & IT
ECCOMAS Multidisciplinary Jubilee Symposium
Josef Eberhardsteiner • Christian Hellmich • Herbert A Mang • Jacques Priaux
Inbunden
2319:-
Uppskattad leveranstid 10-16 arbetsdagar
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- Pocket/Paperback 2319:-
This book contains 23 papers presented at the ECCOMAS Multidisciplinary Jubilee Symposium - New Computational Challenges in Materials, Structures, and Fluids (EMJS08), in Vienna, February 1820, 2008. The main intention of EMJS08 was to react adequately to the increasing need for interdisciplinary research activities allowing ef?cient solution of complex problems in engineering and in the applied sciences. The 15th anniversary of ECCOMAS (European Community on Computational Methods in Applied Sciences) provided a suitable frame for taking the afo- mentioned situation into account by inviting distinguished colleagues from d- ferent areas of engineering and the applied sciences, encouraging them to choose multidisciplinary topics for their lectures. The main themes of EMJS08 have a long tradition in engineering and in the applied sciences: materials, structures, and ?uids. The solution of scienti?c pr- lems involving ?uids together with solids and structures, not to forget the materials the structures are made of, is of paramount importance in a technical world of rapidly increasing sophistication, referred to as the Leonardo World by the eminent German philosopher Jurgen Mittelstra. More recently, the main themes of EMJS08 have gained considerable mom- tum, owing to signi?cant progress in nanotechnology. It enables resolution of a multitude of materials into their micro- and nanostructures. Covering aspects such as Physical and chemical characterization Multiscale modeling concepts, continuum micromechanics, and computational homogenization, as well as Applications in various engineering ?elds the individual contributions to this book ?ow along different tracks of ?uids, materials, and structures.
- Format: Inbunden
- ISBN: 9781402092305
- Språk: Engelska
- Antal sidor: 360
- Utgivningsdatum: 2009-01-16
- Förlag: Springer-Verlag New York Inc.