Interconnect Reliability In Advanced Memory Device Packaging 1
bokomslag Interconnect Reliability In Advanced Memory Device Packaging

Interconnect Reliability In Advanced Memory Device Packaging

Gan Chong Leong Gan • Huang Chen-Yu Huang

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Andra format:

  • 2023
  • Författare: Gan Chong Leong Gan, Huang Chen-Yu Huang
  • Format: Pocket/Paperback
  • ISBN: 9783031267093
  • Språk: Engelska
  • Utgivningsdatum: 2023-04-29
  • Förlag: Springer Nature B.V.

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