Vetenskap & teknik
Modeling and Application of Flexible Electronics Packaging
Yongan Huang • Zhouping Yin • Xiaodong Wan
Inbunden
1429:-
Uppskattad leveranstid 10-16 arbetsdagar
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This book systematically discusses the modeling and application oftransfer manipulationfor flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of theequipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field ofmicroelectronics.
- Format: Inbunden
- ISBN: 9789811336263
- Språk: Engelska
- Antal sidor: 287
- Utgivningsdatum: 2019-05-07
- Förlag: Springer Verlag, Singapore