Practical Guide to the Packaging of Electronics

Taking a simple approach for estimating thermal and mechanical characteristics of electronic systems, this reference emphasizes reliability problems and the design of systems with incomplete criteria and components. Topics include packaging design and reliability; thermal, junction-to-case, and contact interface resistance; direct and indirect flow system design; fin design and fan selection; vital elements of shock and vibration; the finite element method; thermal stresses and strains in the design and analysis of mechanically reliable systems; the selection of engineering software to facilitate system analysis; and design parameters in an avionics electronics package; and more.