Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Printed collection of 90 full-length, peer-reviewed technical papers. Topics include: Autonomous, Hybrid, and Electric Vehicles Energy Conversion and Storage Flexible and Wearable Electronics Heterogeneous Integration Internet of Things Photonics and Optics Power Electronics Servers of the Future, Edge and Cloud Computing: Papers Honoring Michael Ellsworth for Contributions and Service to ASME InterPACK, the Electronic and Photonic Packaging Division, and Leadership in Liquid Cooling of Server Systems