bokomslag Scanning Ion Conductance Microscopy
Vetenskap & teknik

Scanning Ion Conductance Microscopy

Tilman E Schffer

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  • 230 sidor
  • 2023
This book provides a selection of recent developments in scanning ion conductance microscopy (SICM) technology and applications. In recent years, SICM has been applied in an ever-increasing number of areas in the bioanalytical sciences. SICM is based on an electrolyte-filled nanopipette with a nanometer-scale opening, over which an electric potential is applied. The induced ion current is measured, which allows to directly or indirectly quantify various physical quantities such as pipette-sample distance, ion concentration, sample elastic modulus among many others. This makes SICM well suited for applications in electrolytes - most prominently for the study of live cells. This book starts with a historic overview starting from the days of the invention of SICM by Paul Hansma at the University of California at Santa Barbara in 1989. SICM is a member of the family of scanning probe microscopies. It is related to another prominent member of the family, atomic force microscopy (AFM), which has found application in almost any field of nanoscale science. The advantages and disadvantages of SICM over AFM are also outlined. One of the most effective and break-through applications of SICM nanopipettes is in electrochemistry. The different routes and applications for doing electrochemistry using nanopipettes are also discussed. In addition the book highlights the ability of SICM for surface positioning with nanometer precision to open up new vistas in patch clamp measurements subcellular structures. Finally the book presents one research area where SICM has been making a lot of contributions, cardiac research and the endeavors to combine SICM with super-resolution optical microscopy for highest-resolution joint topography and functional imaging.
  • Författare: Tilman E Schffer
  • Format: Pocket/Paperback
  • ISBN: 9783031144455
  • Språk: Engelska
  • Antal sidor: 230
  • Utgivningsdatum: 2023-10-02
  • Förlag: Springer International Publishing AG