bokomslag Self-Organized 3D Integrated Optical Interconnects
Vetenskap & teknik

Self-Organized 3D Integrated Optical Interconnects

Tetsuzo Yoshimura

Inbunden

2279:-

Funktionen begränsas av dina webbläsarinställningar (t.ex. privat läge).

Uppskattad leveranstid 7-12 arbetsdagar

Fri frakt för medlemmar vid köp för minst 249:-

  • 380 sidor
  • 2021
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve short line distances of the cmmm order and large line counts of hundreds-thousands. This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
  • Författare: Tetsuzo Yoshimura
  • Format: Inbunden
  • ISBN: 9789814877046
  • Språk: Engelska
  • Antal sidor: 380
  • Utgivningsdatum: 2021-03-09
  • Förlag: Jenny Stanford Publishing