Technologies for Printed Sensors and Electronics
Ravinder Dahiya • Abhishek Singh Dahiya • Matti Mäntysalo
Inbunden
In Technologies for Printed Sensors and Electronics, an expert team of engineers delivers a comprehensive survey of a variety of contact and non-contact printed electronics manufacturing technologies, as well as their applications. The book brings together printing techniques and offers detailed discussions of their potential capabilities and the critical limitations of each technology. The authors also describe how those limitations might be solved and alternatives that might be explored in the future.
Technologies for Printed Sensors and Electronics describes the potential development of a common platform, assuming that the limitations of a single method might be overcome by the advantages of the others. It also evaluates printed electronics on the basis of the electrical characteristics of the resulting devices or sensors, the materials they're made of, and their anticipated applications.
The book also includes:
- A thorough introduction to the history of printed electronics, including push and pull factors influencing the rise of printed electronics and the repurposing of traditional printing techniques for printed electronics
- Comprehensive explorations of functional materials used in printable electronic materials, including their classification and discussions of organic and inorganic materials
- In-depth examinations of substrates and packaging materials and their physical and chemical behavior, as well as discussions of use constraints in different applications
Perfect for senior undergraduate and graduate students in electrical and electronics engineering, material science, 3D printing, physics, and chemistry, Technologies for Printed Sensors and Electronics will also earn a place in the libraries of researchers, practitioners, and students working in or studying biomedical engineering.
- Format: Inbunden
- ISBN: 9781119734185
- Språk: Engelska
- Utgivningsdatum: 2025-09-01
- Förlag: Wiley-IEEE Press