bokomslag Thin Film Transistors
Vetenskap & teknik

Thin Film Transistors

Yue Kuo

Pocket

4249:-

Funktionen begränsas av dina webbläsarinställningar (t.ex. privat läge).

Uppskattad leveranstid 10-16 arbetsdagar

Fri frakt för medlemmar vid köp för minst 249:-

Andra format:

  • 1016 sidor
  • 2014
References ...170 List of Symbols ...176 CHAPTER 4 a-Si:H TFT Structures ...183 YueKuo 1. Introduction ...183 2. Basic Structures ...183 3. Simplified Structures and Processes ...188 4. Unique Structures and Processes ...192 5. Redundant Structures ...195 6. Summary ...198 References ...200 List of Symbols ...202 CHAPTER 5 Deposition of Intrinsic and Doped Semiconductor Thin Films for a-Si:H TFT ...203 YueKuo 1. Introduction ...203 2. Semiconductor Layer Deposition ...206 3. Doped Amorphous and Microcrystalline Silicon ...223 4. Summary ...231 References ...233 List of Symbols ...239 CHAPTER 6 Deposition of Dielectric Thin Films for a-Si:H TFT ...241 YueKuo 1. Introduction ...241 2. Selection of Dielectric Materials and Deposition Methods ...242 3. PECVD SiNx Dielectric Layer ...244 4. Yield Issues Related to Dielectrics ...263 5. Summary ...265 References ...267 List of Symbols ...271 CHAPTER 7 Plasma Etching in a-Si:H TFT Array Fabrication ...273 YueKuo 1. Introduction ...273 2. Topics in Plama Etching of a-Si:H TFTs ...278 Table of Contents Vll 3. Summary ...306 References ...307 CHAPTER 8 Metallization in a-Si:H TFT Array Fabrication ...3 13 Ken-ichi Onisawa, Shinji Takayama, Yuzo Shigesato, Takuya Takahashi 1. Introduction ...313 2. Basic Understanding of Conductor Lines in TFT LCDs *...*...314 3. Conductor Requirements for a-Si:H TFTs ...318 4. Conducting Materials for TFT Array ...321 5. Key Issues in Conducting Materials for Advanced TFT Array Fabrication ...324 6. Conductor Deposition for TFT Arrays ...337 7. Wet Etching of Conductors for a-Si:H TFT Arrays ...347 8. Summary ...
  • Författare: Yue Kuo
  • Format: Pocket/Paperback
  • ISBN: 9781461350569
  • Språk: Engelska
  • Antal sidor: 1016
  • Utgivningsdatum: 2014-03-18
  • Förlag: Springer-Verlag New York Inc.