3D IC Integration and Packaging

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A comprehensive guide to 3D IC integration and packaging technology

3d ic integration and packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.


3d ic integration and packaging covers:


 3D integration for semiconductor IC packaging
 Through-silicon vias modeling and testing
 Stress sensors for thin-wafer handling and strength measurement
 Package substrate technologies
 Microbump fabrication, assembly, and reliability
 3D Si integration
 2.5D/3D IC integration
 3D IC integration with passive interposer
 Thermal management of 2.5D/3D IC integration
 Embedded 3D hybrid integration
 3D LED and IC integration
 3D MEMS and IC integration
 3D CMOS image sensors and IC integration
 PoP, chip-to-chip interconnects, and embedded fan-out WLP