bokomslag Through-Silicon Vias for 3D Integration
Vetenskap & teknik

Through-Silicon Vias for 3D Integration

John Lau

Inbunden

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  • 512 sidor
  • 2012

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A comprehensive guide to TSV and other enabling technologies for 3D integration

written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.

this book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3d integration research and development, those who wish to master 3d integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.

coverage includes:

  • Nanotechnology and 3D integration for the semiconductor industry
  • TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing
  • TSVs: mechanical, thermal, and electrical behaviors
  • Thin-wafer strength measurement
  • Wafer thinning and thin-wafer handling
  • Microbumping, assembly, and reliability
  • Microbump electromigration
  • Transient liquid-phase bonding: C2C, C2W, and W2W
  • 2.5D IC integration with interposers
  • 3D IC integration with interposers
  • Thermal management of 3D IC integration
  • 3D IC packaging

  • Författare: John Lau
  • Format: Inbunden
  • ISBN: 9780071785143
  • Språk: Engelska
  • Antal sidor: 512
  • Utgivningsdatum: 2012-12-16
  • Förlag: McGraw Hill