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bokomslag Recent Trends in VLSI and Semiconductor Packaging
Data & IT

Recent Trends in VLSI and Semiconductor Packaging

T Vasudeva Reddy K Madhava Rao

Inbunden

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Andra format:

  • 648 sidor
  • 2025
The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (SMART-2024) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. SMART-2024 seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
  • Författare: T Vasudeva Reddy, K Madhava Rao
  • Format: Inbunden
  • ISBN: 9781041017868
  • Språk: Engelska
  • Antal sidor: 648
  • Utgivningsdatum: 2025-05-06
  • Förlag: CRC Press