Recent Trends in VLSI and Semiconductor Packaging
Häftad, Engelska, 2025
849 kr
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Fri frakt för medlemmar vid köp för minst 249 kr.The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
Produktinformation
- Utgivningsdatum2025-05-06
- Mått210 x 280 x 35 mm
- Vikt1 200 g
- SpråkEngelska
- Antal sidor616
- FörlagTaylor & Francis Ltd
- EAN9781041017875