Vetenskap & teknik
RF and Microwave Microelectronics Packaging II
Ken Kuang • Rick Sturdivant
Inbunden
1819:-
Uppskattad leveranstid 10-16 arbetsdagar
Fri frakt för medlemmar vid köp för minst 249:-
Andra format:
- Pocket/Paperback 1299:-
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
- Illustratör: Bibliographie 130 farbige Abbildungen
- Format: Inbunden
- ISBN: 9783319516967
- Språk: Engelska
- Antal sidor: 172
- Utgivningsdatum: 2017-03-22
- Förlag: Springer International Publishing AG