bokomslag RF and Microwave Microelectronics Packaging
Vetenskap & teknik

RF and Microwave Microelectronics Packaging

Ken Kuang Franklin Kim Sean S Cahill

Inbunden

2249:-

Funktionen begränsas av dina webbläsarinställningar (t.ex. privat läge).

Uppskattad leveranstid 10-16 arbetsdagar

Fri frakt för medlemmar vid köp för minst 249:-

Andra format:

  • 285 sidor
  • 2009
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
  • Författare: Ken Kuang, Franklin Kim, Sean S Cahill
  • Illustratör: 15 schwarz-weiße Tabellen 100 schwarz-weiße Abbildungen
  • Format: Inbunden
  • ISBN: 9781441909831
  • Språk: Engelska
  • Antal sidor: 285
  • Utgivningsdatum: 2009-11-17
  • Förlag: Springer-Verlag New York Inc.