RF and Microwave Microelectronics Packaging II 1

Vetenskap & teknik

RF and Microwave Microelectronics Packaging II

Ken Kuang • Rick Sturdivant

Pocket

1289:-

Funktionen begränsas av dina webbläsarinställningar (t.ex. privat läge).

Uppskattad leveranstid 7-12 arbetsdagar

Fri frakt för medlemmar vid köp för minst 249:-

Andra format:

Inbunden 1799:-

172 sidor
2018

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to RF and Microwave Microelectronics Packaging (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Författare: Ken Kuang, Rick Sturdivant
Format: Pocket/Paperback
ISBN: 9783319847191
Språk: Engelska
Antal sidor: 172
Utgivningsdatum: 2018-06-09
Förlag: Springer International Publishing AG